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PropertyTypical Value(1)DirectionUnitConditionTest Method
RO3203RO3206RO3210
Dielectric Constant,¦ÅrProcess3.02¡À 0.046.15¡À 0.1510.2¡À 0.50Z¨C10 GHz 23¡ãCIPC-TM-650 2.5.5.5 Clamped stripline
(2)Dielectric Constant,¦ÅrDesign3.026.610.8Z¨C8 GHz ¨C 40 GHzDifferential Phase Length Method
Dissipation Factor,tan ¦Ä0.00160.00270.0027Z¨C1.0 GHz 23¡ãCIPC-TM-650 2.5.5.5
Thermal Coefficient of ¦År¨C13¨C212¨C459Zppm/¡ãC10 GHz 0¨C100¡ãCIPC-TM-650 2.5.5.5
Dimensional Stability0.80.80.8X,Ymm/mCOND AASTM D257
Volume Resistivity107103103
M¦¸?cmCOND AIPC 2.5.17.1
Surface Resistivity107103103
M¦¸COND AIPC 2.5.17.1
Tensile Modulus409 351462 462579 517MD CMDkpsi23¡ãCASTM D638
Water Absorption<0.1<0.1<0.1¨C%D24/23IPC-TM-650 2.6.2.1
Specific Heat0.950.850.79
J/g/K
Calculated
Thermal Conductivity0.480.670.81¨CW/m/K80¡ãCASTM C518
Coefficient of Thermal Expansion13 5813 3413 34X,Y,Zppm/¡ãC¨C55 to 288¡ãCASTM D3386¨C94
Td500500500
¡ãCTGAASTM D3850
ColorTanTanOff White



Density2.12.73
gm/cm3

Copper Peel Strength10.210.711
pli1 oz. EDC After Solder FloatIPC-TM-2.4.8
FlammabilityV¨C0V¨C0V¨C0


UL 94
Lead Free Process CompatibleYESYESYES



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Standard ThicknessStandard Panel SizeStandard Copper Cladding
RO3203:
0.010¡± (0.25mm)
0.020¡± (0.50mm)
0.030¡± (0.75mm)
0.060¡± (1.52mm)
12" X 18" (305 X 457mm)
24" X 18" (610 X 457mm)
? oz. (17¦Ìm) electrodeposited copper foil (HH/HH) & rolled copper foil (5R/5R)
1 oz. (35¦Ìm) electrodeposited copper foil. (H1/H1) & rolled copper foil (1R/1R)
2 oz. (70¦Ìm) electrodeposited copper foil. (H2/H2) & rolled copper foil (2R/2R)
RO3206/RO3210:
0.025¡± (0.64mm)
0.050¡± (1.28mm)
12" X 18" (305 X 457mm)
24" X 18" (610 X 457mm)
? oz. (17¦Ìm) electrodeposited copper foil (HH/HH)
1 oz. (35¦Ìm) electrodeposited copper foil. (H1/H1)
2 oz. (70¦Ìm) electrodeposited copper foil. (H2/H2) & rolled copper foil (2R/2R) Other claddings may be available. Contact customer service.

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